China Closes a Key Chipmaking Gap: Wafer Size Integration
China has made a significant step forward in chip manufacturing, addressing a gap that often goes unnoticed. Hwatsing Technology, the country’s leading producer of chemical mechanical polishing (CMP) equipment, has developed a metrology system integrated with its polishing equipment, catering to six-inch wafers.
August 8, 2026 – 11:53 am | Credit: Hwatsing
This system, announced on Thursday, is China’s first combined metrology and CMP setup for six-inch wafers, according to the South China Morning Post.
The Significance of Polishing
Chemical mechanical polishing plays a crucial role in chip production, ensuring the silicon discs are flat and smooth between processing layers. This process is vital for modern chips with dozens of layers, each requiring precise planarity within nanometres to avoid printing issues during the next layer’s application.
Polishing matters more than it seems as it directly impacts yield, a critical factor in an industry where older fabs struggle to maintain high production standards.
Wafer Size and Its Impact
The integrated system operates on 150mm wafers, a format typically associated with mature chip nodes and compound semiconductors. While leading-edge logic uses larger 300mm wafers, this development is a step in the right direction for China’s semiconductor industry.
However, it’s essential to note that this is a ladder step rather than a leap to the top. The tool’s importance lies in its ability to improve wafer uniformity and reduce waste, which is crucial for China’s fabs running older lithography technologies.
Hwatsing’s Achievements
Hwatsing’s track record speaks volumes. According to Georgetown’s Center for Security and Emerging Technology, China’s share of the global CMP equipment market increased from 1.5% in 2022 to nearly 11% in 2023, primarily driven by Hwatsing’s growth.
This success is further evidenced by their recent milestones: shipping 1,000th CMP systems in April and targeting advanced chip manufacturing next. To fuel this expansion, Hwatsing is seeking substantial investments, aiming for up to $552 million through a private placement and a separate $237 million plant investment.
Market Dynamics
Applied Materials currently dominates the global CMP market, with Ebara close behind at approximately 27%. While Hwatsing’s 11% share is significant, it pales in comparison to the leading players.
The real challenge lies elsewhere—in acquiring advanced lithography machines. ASML remains the sole supplier of EUV (Extreme Ultraviolet) lithography machines, and China faces US-led export controls, making it impossible to purchase these machines at any price.
Strategic Self-Sufficiency
Beijing’s strategy is clear: close every gap while the most significant one remains inaccessible. China has made strides in semiconductor equipment self-sufficiency, reaching around 35%, up from 25% just two years ago.